Power Electronics Component Analysis Laboratory

Introduction

The laboratory is a state-of-the-art facility for characterizing and analysis of power modules, discrete transistors and similar power electronics components. The lab is used in post-production quality control for power electronics packaging activities at AAU. It furthermore facilitates the creation of static and dynamic models of power semiconductors. 

In reliability studies, pre- and post-stress analysis of power semiconductors can quantify the impact of stressor on the performance of the device under test. Non-destructive analysis methods can be used to monitor the wear-out of the DUT during the lifetime tests.

Special equipment

KSI v8 scanning acoustic microscope

Uses ultrasound waves for non-destructive analysis of semiconductor assemblies. Can detect voids, cracks, and delaminations inside a sealed package. 20MHz and 50MHz transducers are available with resolution down to 20µm

Keysight B1506A power device analyser

A fully automated power semiconductor analyser capable of automatically producing full device datasheet. Static characteristics up to 3 kV and 1500 A. Features measurement of transistor input, output and reverse transfer capacitances (Ciss, Coss, Crss) as well as gate charge (QG) and resistance (RG).

ATS-515 Thermostream

Fast −50°C to +250°C temperature control system. Can be remotely controlled by the Keysight B1506A power device analyser. Can be programmed to cycle the temperature for reliability studies.

Keysight E4990 impedance analyzer

A 20 Hz to 120 MHz impedance analyzer for characterization of passive components (transformers, inductors, capacitors and DC-link capacitor banks), semiconductor devices, magnetic materials and dielectric materials.

Features & services

The lab offers full device characterization in various stages of product life.

  • Post-production process quality assessment (solder thickness uniformity, solder voids, cracks in ceramic layers).
  • Full datasheet characterization of power semiconductor components.
  • Non-destructive analysis of complex and integrated structures as well as classic power module assemblies.
  • Post-stress evaluation (chip delamination, crack propagation).

Sponsors

Location

Pontoppidanstraede 107, room 2.101

Contact information

Associate Professor Christian Uhrenfeldt
Direct phone: +45 9940 7331
Email: chu@et.aau.dk